MIPI Alliance Releases UniPro 3.0 and M‑PHY 6.0 to Power UFS 5.0 for Edge AI
The move positions the interfaces as the UFS 5.0 interconnect to meet rising performance demands across AI‑capable devices.
Overview
- M‑PHY v6.0 adds an HS‑G6 lane using PAM4 signaling to reach up to 46.694 Gbps per channel, introduces new 1b1b line coding, enables optional link equalization and training, and maintains backward compatibility with v5.0.
- UniPro v3.0 supports up to about 46.6 Gbps per channel per direction with HS‑G6 and brings a new transport frame structure, Reed–Solomon FEC, 64‑bit CRC, data scrambling, Gray coding, precoding, channel alignment, link‑training for equalization, and an application‑layer BER target below 10^-22.
- JEDEC’s forthcoming UFS 5.0 will use MIPI UniPro v3.0 and M‑PHY v6.0 as its interconnect layer, with claims of higher speed, improved signal integrity and enhanced security for storage.
- Both specifications are presented as backward compatible to ease migration and interoperability with existing UniPro v2.0 and M‑PHY v5.0 implementations.
- MIPI and JEDEC scheduled a joint webinar for March 31, 2026 to brief implementers on the updates, following development that involved companies such as Google, Qualcomm, Samsung, SK hynix, KIOXIA and MediaTek.